Stacked chip of NOKIA Phones
Here two chip are stacked
i. RAPS
ii. FLASH
TO REBALL FLASH
1.Put big nozzle on hot air to lift up. apply flux as needed. Use good quality flux.Otherwise may damage Chip. Do it carefully and slowly that there is no mistake in the work.
The 1st is Flash and second is RAPs
clean all leadfree materials on pcb and on chip. this should be done perfectly,
in order to get perfectly joint contact on our next reballing with leaded tin paste.
there is nothing special when reballing on lower part (rap to pcb side).
2. Now, reball flash and repet the process till correct ball size.
Put it on rap. again, use big nozzle on hot air. lower temp, lower air flow.
Now your phone is ready.
Prec.
1. Back all rpl
2. Back all certificates
3. Back all PM
After reball phone may be in test/local mode
Then, Flash it with latest firmware, restor all cert,rpl,PM do rfbb tune, dcc if needed.
Thanks to gbluez for photograph/adv Manole and also that persons according to whome there is no flash chip on N5130.
And special thanks to my big Br ripgsm
N.B. I am not responsible for any damage coused by this procdure. I post here only my work by which I succed in many times.
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